Microscope image of electromigration-induced hillock and void
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Observation of void formation patterns in SnAg films undergoing electromigration and simulation using random walk methods
Observation of void formation patterns in SnAg films undergoing electromigration and simulation using random walk methods
Athermal and thermal coupling electromigration effects on the microstructure and failure mechanism in advanced fine-pitch Cu interconnects under extremely high current density - ScienceDirect
The electromigration effect revisited: non-uniform local tensile stress-driven diffusion
Thermal Stress Characteristics and Stress-Induced Void Formation in Aluminum and Copper Interconnects (Chapter 3) - Electromigration in Metals
Stress relaxation and failure behavior of Sn–3.0Ag–0.5Cu flip-chip solder bumps undergoing electromigration, Journal of Materials Research
Electromigration Encyclopedia MDPI
Micromachines, Free Full-Text
Electromigration - an overview
The electromigration effect revisited: non-uniform local tensile stress-driven diffusion. - Abstract - Europe PMC
Customized 2D Structures for High Throughput Electromigration Measurements - Ravandi - 2019 - physica status solidi (a) - Wiley Online Library
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